The company holds multiple patents related to bus ducts. For instance, the patent for “A Bus Duct with a Connector and Heat Dissipation Device” features a design with multiple heat dissipation devices inside the bus duct body, equipped with bus bars on both sides. The heat dissipation device consists of a heat dissipation frame, heat dissipation strips, corrugated fins, and needle-like fins. The unique structural design allows internal airflow to circulate effectively through three ventilation channels, enhancing heat dissipation performance. Another patent, “A Bus Duct with a Housing and Heat Dissipation Holes,” utilizes the structural design of thermal insulation boards, guide wind boards, and guide wind slots, combined with optimized heat dissipation hole layouts and the integration of heat dissipation blocks. This achieves efficient management of heat during power transmission, improves heat dissipation efficiency, and extends the service life of the bus duct and insulating materials.